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Discrete semiconductor devices and integrated circuits. Optoelectronic devices - Measuring methods

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Discrete semiconductor devices and integrated circuits. Optoelectronic devices - Measuring methods1 Scope This part of IEC 60747 describes the measuring methods applicable to the optoelectronic devices which are not intended to be used in the fibre optic systems or subsystems.

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a) in the following cases :

BS EN 1007-6 is a European Standard

This document specifies mechanisms to choose between the keyboard groups specified in the ISO/IEC 9995 series

but it is nevertheless used to express the amount of LAS as determined by UV light absorbance measurements in terms of a detergent amount

BS 1041-5 also states the advantages of radiation pyrometers

BS EN 62047-25 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based microelectromechanical system (MEMS)

they prevail on it

so there is an enormous demand for cable test techniques to ensure cables and joints are in good condition

Correction of the table headlines of Tables B

Response times of protective equipment used

BS EN IEC 60721-2-4:2018 will assist product designers in evaluating the effects of solar radiation on the products in service both in terms of the n of physical properties of materials and the effects of solar heating and the operating temperatures attained as a result

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